Cadence Design Systems, Inc. today introduced the Tempus Timing Signoff Solution, a new static timing analysis and closure tool designed to enable System-on-Chip (SoC) developers to speed timing closure and move chip designs to fabrication quickly. More...
Ultra low power (ULP) RF specialist Nordic Semiconductor ASA today announces that its multiple award-winning nRF51822 SoC ('System-on-Chip') has been specified into the world's smallest Bluetooth low energy coin-sized location stickers, 'StickNFind' by Stick-N-Find Technologies. More...
Skyworks Solutions, Inc. introduced groundbreaking RF switching technology that is enabling early adopters to implement carrier aggregation solutions. More...
Microchip Technology Inc. today announced from the Bay Area Maker Faire in San Mateo, Calif. the expansion of its Arduino compatible chipKIT platform ecosystem, with new tools from partners Digilent, Inc. More...
To simplify the development of ZigBee wireless connectivity-enabled smart energy infrastructure, home and building automation and intelligent lighting gateways, Texas Instruments Incorporated today announced the availability of the CC2538 system-on-chip (SoC). More...
connectBlue today launched the Ethernet Port Adapter RWE251s which features Wireless LAN (WLAN) dual-band functionality and an omnidirectional external stub antenna. More...
ON Semiconductor continues to expand its portfolio of high performance IGBTs targeted at high performance power conversion (HPPC) consumer appliance and industrial applications. More...
The first transformer-based, isolated gate drive solutions were quickly discarded when optocoupler-based gate drivers (opto-drivers) emerged. For the last three decades, opto-drivers have been the "go-to" isolated gate driver solution because they provide isolated gate drive functionality and inherent high-side level shifting in a single package. More...
In most cases today, IC power analysis efforts are mainly focused at signoff. Even though some place and route (P&R) solutions provide simple checks at the floor planning stage, there are a lot of opportunities to improve power analysis capabilities during design, and to align and integrate these with the signoff tools and the overall design flow. More...
Microchip Technology Inc. today announced an expansion of its 8-bit PIC16F178X enhanced Mid-Range core microcontroller family with increased Flash memory densities, intelligent analog and digital peripherals. More...
Cadence Design Systems, Inc. today introduced a new version of Incisive Enterprise Simulator, with features that improve low-power verification productivity of complex SoCs by 30 percent. More...
Silicon Labs today introduced the industry’s first digital CMOS-based drop-in replacement solution for optocoupler-isolated gate drivers (opto-drivers). More...
Cadence Design Systems, Inc. today announced its intent to acquire the IP business of Evatronix SA SKA, adding to its rapidly expanding IP offering. More...
Attracting attendees from all aspects of the reconfigurable radio value chain, SDR-WInnComm is the ideal place to network and make an impact on the advanced wireless radio community. More...
Atmel Corporation today announced the maXTouch T Series, its next-generation family supporting touchscreens up to 23 inches for applications such as handsets, tablets, Ultrabooks, notebooks and all-in-one computers. More...
The Wireless Innovation Forum today announced enthusiastic support of Ofcom's 26 April announcement that it will launch a white space devices pilot program this autumn. More...
Spansion Inc. today announced they have executed a definitive agreement for Spansion to acquire the Microcontroller and Analog Business of Fujitsu Semiconductor for approximately $110 million, plus approximately $65 million*1 for inventory. More...
Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES has collaborated with Cadence to provide pattern classification data for manufacturing processes of 20 and 14 nanometers. More...
Synopsys, Inc. today announced the immediate availability of the Embedded Vision Development System, an integrated solution for the acceleration of the design of processors for embedded vision based on Synopsys' Processor Designer tool set and Synopsys' HAPS FPGA-based prototyping system. More...
Nordic Semiconductor ASA today announces the immediate availability of two wafer-level chip-scale package variants of its existing QFN-packaged nRF51822 and nRF51422 SoCs that will now join the company's class-leading nRF51 Series. More...
Silicon Labs today introduced the industry’s first single-die antenna-input-to-audio-output digital radio receiver solution developed for the global portable and consumer electronics markets. More...
Marvell today announced the availability of its Smart Bulb Residential Wireless Platform, which provides a cost-effective, open, end-to-end solution for manufacturers developing smart lighting systems that adhere to Energy Star power consumption requirements. More...
TI introduces lowest-power AISG modem transceiver
Texas Instruments Incorporated (TI) today introduced a fully-integrated, on-off keying modem transceiver that is compliant with the Antenna Interface Standards Group (AISG) v2.0 specification. More...
Mentor Graphics Corp. today announced hardware and software solutions to accelerate the verification of Serial Attached SCSI (SAS) second-generation (Gen 2) products, having speeds up to 6Gbps. More...
Pericom Semiconductor Corporation today announced new switching and power management products targeting advanced connectivity requirements of the latest CPU chipsets for mobility and related applications. More...
ARM and Cadence today announced details behind their collaboration to implement the first ARM Cortex-A57 processor on TSMC's 16-nanometer (nm) FinFET manufacturing process. More...
Xilinx, Inc. today announced two major advances in productivity as part of a new major release of the Vivado Design Suite, the programmable industry's first SoC-strength design suite. More...
Silicon Labs today announced that its Ember ZigBee solutions – silicon devices, software and development tools – have achieved Golden Unit certification from the ZigBee Alliance for the newly released ZigBee IP specification. More...
More than 100 developer and adopter members of the Hybrid Memory Cube Consortium (HMCC) today announced they’ve reached consensus for the global standard that will deliver a much-anticipated, disruptive memory computing solution. More...
Accellera Systems Initiative (Accellera) today announces the formation of a new Multi-language Working Group (MLWG). More...
New Challenges for IC Power Grid Analysis
Today, IC designers routinely include both static and dynamic power analysis, but with exploding design sizes and added complexity, power analysis solutions are struggling to keep up with all the new requirements. This article describes the new areas of power verification and the challenges associated with these checks. More...
GreenPeak Launches the New GP501 ZigBee Radio Chip
GreenPeak Technologies today announces the GP501, a new generation of ZigBee transceivers which contains a sophisticated coexistence scheme that allows Wi-Fi, Bluetooth and ZigBee chips to work side by side in the same device. More...
ARM and Synopsys today announced the availability of optimized 28-nanometer (nm) Synopsys Reference Implementations for ARM Cortex-A15 MPCore and Cortex-A7 MPCore processor clusters as well as the CoreLink CCI-400 cache-coherent interconnect. More...
At APEC 2013 today, NXP Semiconductors N.V.introduced its new GreenChip solution designed to make smartphone and tablet chargers more compact, energy-efficient and cost-effective – without sacrificing reliability. More...
Renesas Electronics America today announced the launch of the Renesas’ stream Application Programming Interface (API) license program for implementation externally. More...
Tektronix, Inc. today announced the industry’s first demonstration of a M-PHY test solution for silicon-proven HS-Gear3 IP, a key part of the MIPI Alliance M-PHY physical layer specification for mobile devices. More...
Mentor Graphics Corporation today announced the Nucleus SmartFit product, a cost-effective, binary version of the Nucleus RTOS (real time operating system) optimized to fit the limited internal memory of 32-bit MCUs. More...
Advanced Linear Devices Inc. (ALD) today announced an industry breakthrough in small signal, low power MOSFETs by enabling independent control of each device within a quad package. More...
Green Hills Software today announced a major new release of its INTEGRITY Multivisor for Trusted Mobile Devices. For the first time, enterprise and government mobile device users and administrators can take advantage of off-the-shelf mobile phones and tablets for both personal and business use, with both parties having complete confidence in security and privacy. More...
Cadence Design Systems, Inc. today introduced the first commercially available design IP (IP) and verification IP (VIP) supporting the new Mobile PCI Express (M-PCIe) specification, which enables today's leading innovators to develop products with both PC-class performance and extended battery life. More...
Answering the growing need for smartphone and tablet applications that update seamlessly, Texas Instruments Incorporated (TI) announces a truly wireless solution with a unique over-the-air-download (OTA or OAD) feature in its BLE-Stack 1.3 software for use with the CC2540 and CC2541 Bluetooth low energy system-on-chips (SOCs). More...
Spansion Inc. today announced the joint development of a 40nm process that integrates UMC's 40nm LP logic process with Spansion proprietary embedded Charge Trap Flash memory technology. As part of this non-exclusive agreement, UMC is licensed to manufacture products based on this technology for Spansion. More...
Alta Devices today disclosed that it has reached 30.8% solar cell efficiency. This new NREL verified record has resulted from the company’s first implementation of a new generation “dual junction” solar cell technology which augments the company’s “single junction” technology. More...
Skyworks Expands Suite of 802.11ac Solutions
Skyworks Solutions, Inc. today expanded its wireless portfolio with the introduction of highly integrated front-end modules enabling 802.11ac connectivity in smartphones and tablets. More...
Mentor Graphics Corp. today announced availability of the Kronos Cell Characterization and Analysis platform.More...
Application-Specific Tablets Innovate the Industrial Market
The tablet has been a part of the consumer computing market since it was first introduced on a global scale by Apple in 2010. The overwhelming initial adoption by consumers laid the ground work for tablet use in enterprise, but the conversion was slow at first. Today this hesitation has subsided, and tablet computing in many business sectors is growing exponentially. Manufacturers are able to create application-specific design capabilities that tailor tablets to each industry that uses it. They are being created with the hardware and software needed for operational applications in everything from retail stores to healthcare. More...
Multicore Association Unveils Specification to Ease Programming of SoCs
After 1.5 years of working-group effort, the Multicore Association, a global non-profit organization that develops standards to speed time-to-market for products with multicore processor implementations, has announced the availability of its Multicore Task Management Application Program Interface (MTAPI) that supports the coordination of tasks on embedded parallel systems. More...
Xilinx Inc., today announced the availability of a high performance development solution for designing next-generation heterogeneous wireless networks, such as high-end picocells, microcells, macrocells, and active antenna arrays. More...
Mentor Graphics Corp. today announced the 10.2 release of the Questa functional verification platform, a tightly integrated and extensible set of tools and solutions that is transforming the functional verification of complex System-on-Chip (SoC) and FPGA designs. More...
Tensilica, Inc. and mimoOn today announced a new LTE and LTE-Advanced PHY library that will significantly speed up development of chips including Tensilica's ConnX BBE32 family of DSP (digital signal processor) IP cores. More...
ARM and STMicroelectronics have announced the availability of the first ever Embedded Coder support, with MATLAB and Simulink, for ARM Cortex-M processor-based systems. More...
Agilent Technologies Inc. today announced the newest release of SystemVue, its premier platform for designing communications and defense systems. More...
The Multicore Association announces availability of the Multicore Programming Practices (MPP) guide to provide developers with a detailed set of best practices for writing multicore-ready embedded software.
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NXP Software and Tensilica, Inc. today announced that NXP Software's LifeVibes VoiceExperience is now available and optimized for Tensilica's HiFi Audio/Voice DSP family.
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Tensilica, Inc. today introduced IVP, an imaging and video dataplane processor (DPU) that is ideal for the complex image/video signal processing functions in mobile handsets, tablets, digital televisions (DTV), automotive, video games and computer vision based applications.
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Designing Wireless Devices Powered by Microharvesters
Wireless sensors and remote controllers can operate without batteries if you use energy harvesting devices to harvest energy from the environment. However, if you use a microharvester, you must make tradeoffs between finding available energy and device energy consumption. This task is less difficult if you have a way to make power-related measurements that can accurately show the dynamic nature of low-power devices. This article explores what it takes to design low-power devices to use with microharvesters.
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Domestic, commercial and public lighting systems can now be made greener, more economical, safer and more flexible, thanks to a unique device introduced by STMicroelectronics a global semiconductor leader serving customers across the spectrum of electronics applications and a world leader in power-management solutions.
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Synopsys, Inc. today announced the extension of its software development tools offering for ARM processor-based systems with the VDK Family for ARMv8 Processors.
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Calypto Design Systems, Inc. and Real Intent, Inc. today announced the integration of Calypto’s Catapult high-level synthesis tool and Real Intent’s Ascent Lint product.
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Cadence Design Systems, Inc. today announced an agreement to acquire Cosmic Circuits Private Limited, a leading provider of analog and mixed signal intellectual property (IP) cores.
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Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES has certified essential Cadence technologies for custom/analog, digital and mixed-signal design, implementation, and verification for its 20-nanometer LPM technology.
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Linear Technology Corporation introduces the LTM8045, a 2.8V-18V input, multi-topology DC/DC µModule (micromodule) converter, with onboard inductor, power switch and DC/DC controller delivering up to 700mA output current.
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Texas Instruments Incorporated (TI) today introduced the industry’s first single-chip, front-end power management unit (PMU) for battery-powered applications based on ARM Cortex A9 and A15 processors.
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Atmel Corporation today announced it is shipping production quantities of the Atmel SAMA5D3 series, its highest performance, low-power microprocessor units (MPUs) based on the ARM Cortex-A5 core.
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Microchip Technology Inc. today announced the expansion of its wireless product portfolio with a certified Bluetooth Audio Module that supports audio for voice and music.
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Allegro MicroSystems, Inc. introduces a new dual analog/PWM output, one-time programmable, linear IC which allows the user to optimize the device in a finished sensor assembly.
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The Embedded Microprocessor Benchmark Consortium (EEMBC) today announced its intent to create a standardized, industry-endorsed method to evaluate the energy efficiency of ultra-low power (ULP) microcontrollers.
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Freescale Semiconductor introduces the C29x family of crypto coprocessors – a new lineup of security accelerators engineered to help the world’s top data center equipment manufacturers efficiently scale to handle dramatic increases in secure network traffic.
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Microchip Technology Inc. today announced its MCP19111, the world’s first Digitally Enhanced Power Analog controller, which expands Microchip’s diverse range of intelligent DC/DC power-conversion solutions.
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Today, Renesas Electronics America Inc. announced the development of a new, cost-effective Solutions Kit for the RX family of MCUs, enabling engineers working in a broad mix of application segments to take advantage of Renesas’ low-power and high-performance RX family.
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Cadence Design Systems, Inc. today announced the availability of Virtuoso Advanced Node, a new set of breakthrough custom/analog capabilities designed specifically for the advanced technology nodes of 20 nanometers and below.
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IN NOVEMBER 2006, it took hours for fifty fire fighters to quench the blaze at it raged through the Securaplane Technologies building in Tucson, Arizona.
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Offering more memory in its 16-bit microcontroller portfolio than ever before, Texas Instruments Incorporated today announces MSP430F66xx microcontrollers with embedded 512K Flash and 64K RAM.
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JTAG Technologies has broadened its portfolio by offering a unique Power Management Bus (PMBus) IC programming solution that supports devices from leading vendors Linear Technologies and TI.
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Lattice Semiconductor Corporation today announced an array of advancements to its software platforms, debuting new versions of Lattice Diamond and iCEcube2 design tools.
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Anagear today announced the introduction of the ANG101x Development Kit. The kit gives system developers a quick and easy way to become familiar with the features and benefits of the company’s innovative ANG101x family of power management ICs.
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CSR plc today announced the availability of new Evaluation and Development Kits for makers of the newest generation of Smart Remotes for TVs and Set Top Boxes (STBs).
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Developers can now give their TI microcontroller (MCU) LaunchPad Evaluation Kits an extra boost – and showcase it at one of the largest technology trade shows in the world!
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RF Micro Devices, Inc. today introduced the highly-integrated RFFM4501E front end module (FEM) for 802.11ac notebook and mobile equipment applications.
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Atmel Corporation today announced it has expanded its ARM Cortex-M4 based Flash family to include the SAM4E series, which features advanced connectivity peripherals, a floating point unit (FPU), advanced analog capabilities, and higher processing power.
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Microchip Technology Inc today announced the first and only Wi-Fi audio connectivity platform—featuring the new JukeBlox 3.2 platform and software development kit—to support all of the major mobile and PC operating systems along with the DLNA standard.
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Mentor Graphics Corporation today announced expanded embedded Linux development support for Freescale QorIQ devices with the Mentor Embedded Linux and Sourcery CodeBench products.
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InvenSense, Inc. introduces a second generation, category defining, 9-axis MotionTracking device. The MPU-9250, in a 3x3x1mm QFN package, is 33% smaller than the nearest competitor.
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Texas Instruments Incorporated today announced the full availability of a new ZigBee BoosterPack based on TI’s CC2530 ZigBee system-on-chip that enables developers to jumpstart their designs.
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With the Internet of Things (IoT) revolution, new devices are wirelessly connected to the home network and to the cloud. However, headless devices with no keypads or touchscreens including garage door openers, home appliances, lights, thermostats and treadmills can be complicated to connect to a Wi-Fi network.
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Tensilica, Inc. today introduced the HiFi Mini DSP (digital signal processor) core, the smallest, lowest power DSP IP core supporting always listening voice trigger and speech command modes. More...
Selecting Antennas for Embedded Designs
The wide range of RF protocol choices available to embedded developers makes the already complex choice of antennas that much more difficult. Gain, directionality, and bandwidth all represent serious tradeoffs that dictate the choice of antennas—dipole, monopole, patch, flat bar, center fed, end fed—the choices are seemingly endless. So called smart antennas make the choice that much more complex, as does the fact that the layout of your PCB will almost guarantee that the antenna you choose won’t work as advertized. More...
ARM and Cadence Design Systems, Inc. today announced the tape-out of the first 14-nanometer test chip implementation of the high-performance ARM Cortex-A7 processor, the most energy-efficient applications processor from ARM. More...
Renesas Electronics Corporation today announced the development of the R2A20057BM lithium-ion (Li-ion) battery charge controller IC for mobile devices employing one cell Li-ion batteries, such as digital still cameras and smartphones. More...
With the increasing popularity and use of single-mode Bluetooth low energy in automotive, home office, medical and health, sports and fitness, and mobile and PC accessories, Texas Instruments Incorporated released its newest BLE-Stack 1.3 software to support continued development and enhancement of Bluetooth low energy. More...
Analog Devices, Inc. (ADI) today introduced a high precision amplifier offering the industry’s best combination of offset voltage, voltage thermal drift, bandwidth, slew rate and voltage noise for front-end amplifier circuits. More...
3 Musts for Reducing RTL Power
Power management has emerged as a major design challenge in chip design today. The new importance of power consumption is not only coming from the increased proliferation of mobile devices, where extending battery life offers a huge competitive edge, but also from databanks and servers, where the infrastructure for providing power, cooling, and heat dissipation is getting very costly and outright prohibitive. More...
Mentor Graphics Corporation today announced significant advances in their T3Ster+TeraLED measurement and characterization hardware, as well as in FloEFDT software simulation products, to meet the needs of lighting developers using arrays of LEDs in headlights, taillights and other transportation industry applications. More...
Extending battery life in ultra low power wireless applications
Ultra low power (ULP) wireless is on the up. Proprietary 2.4GHz technologies have steadily carved a growing niche in applications as diverse as wireless desktops, remote controls and fitness monitoring sensors such as heart rate belts. More...
Offering total system power savings for co-processor designs, Texas Instruments Incorporated (TI) today announces the new MSP430F521x/F522x microcontroller family. More...
