Renesas Electronics Introduces IGZO Bridging Interface for Analog and Power Devices in Smart Systems at IEDM 2011

Thin-Profile IGZO On-Chip Interface Technology Enables Direct High/Low Voltage Control for Intelligent Systems like Smart Cars, Homes and White Goods

SANTA CLARA, Calif., December 5, 2011—Renesas Electronics Corporation today announced the development of a new interface technology that enables simple and reliable signal controls for on-chip, high/low voltage bridging between analog and power (A&P) devices and microcontrollers (MCUs) or systems-on-chip (SoCs). The InGaZnO (IGZO) interface technology will be essential to achieve small form factor, low-power SoCs and MCUs that support a wide variety of power supply voltages, which will be key for “smart systems” that will further enable a smart society, such as EVs/HVs, robotics, intelligent home appliances, smart-grids as well as visual panels.

Renesas will present the results of this research at the 2011 International Electron Devices Meeting (IEDM), December 5-7, at the Hilton Washington in Washington D.C.

Session Information

What: Highly Reliable BEOL-Transistor with Oxygen-controlled InGaZnO and Gate/Drain Offset Design for High/Low Voltage Bridging I/O Operations

When: December 5, 2:50 pm

Where: Colombia 5&7 (in Hilton Washington)

Who: Kishou Kaneko, Researcher, Renesas Electronics Corporation

High/low bridging is a challenge for embedded designers working with smart motors, smart home appliances and other smart applications. Many A&P devices installed in these types of electronics operate with high-voltage power supply (10 V to 100 V), while silicon-based MCUs typically operate at a lower voltage range (1~5V). This gap makes it difficult to directly control high-voltage A&P devices. To resolve this issue, Renesas has developed an interface technology that embeds high-voltage IGZO thin-oxide transistors on the top layer of MCU or SoC interconnects to act as a power supply interface, which enables the MCUs or SoCs to control the high-voltage operation for on-chip IGZO transistors directly. The on-chip integration also helps to reduce power consumption and form factor to achieve smaller and more power-efficient electronic devices.